Supplemental

• Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
• Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
• Load semiconductor material into furnace.
• Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
• Count, sort, and weigh processed items.
• Calculate etching time based on thickness of material to be removed from wafers or crystals.
• Inspect equipment for leaks, diagnose malfunctions, and request repairs.
• Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
• Stamp, etch, or scribe identifying information on finished component according to specifications.
• Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
• Scribe or separate wafers into dice.
• Connect reactor to computer, using hand tools and power tools.
• Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
• Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
• Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
• Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.